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PIR Foam Insulation Board
PIR (Polyisocyanurate) foam insulation board is a high-performance rigid thermal insulation material with excellent fire resistance, low thermal conductivity (from 0.018 W/mK), and high compressive strength. Ideal for roofs, walls, floors, and cold storage applications in energy-efficient buildings.
Structure: Silver Aluminum/ PIR Foam/ Silver Aluminum
Size: 4000*1200*20mm
Foam Density: 50kg/m3
Aluminum Thickness: 0.06mm or 0.08mm
Aluminum Color: Silver
Packing: 10 sheets/ package
Loading Capacity: 710 sheets/ 40'HQ (packed with plastic bags)
660 sheets/ 40'HQ (packed with cardboard box)
Material Nature and Chemical Properties of PIR Foam Insulation Board
The core of PIR insulation board is polyisocyanurate (Polyisocyanurate) rigid foam, which is formed by the modification and polymerization of polyester polyol and polyisocyanate. Unlike ordinary polyurethane (PUR), the molecular structure of PIR contains isocyanurate rings, which makes it significantly superior to PUR in terms of high-temperature resistance, dimensional stability, and fire resistance.
The decomposition temperature of PIR structure is approximately 260°C, while that of ordinary polyurethane is only about 220°C. The applicable temperature range is extremely wide, ranging from cryogenic environments at -196°C to high-temperature working conditions at +120°C. According to the new national standard GB/T21558 released in December 2025 and implemented in July 2026, PIR materials are classified into 8 insulation grades (020 to 040), with the thermal conductivity requirement ranging from 0.020 W/(m·K) to 0.040 W/(m·K). This is the first time that the definition and specific performance requirements of PIR have been clearly defined in a national standard.
Mechanical Properties and Dimensional Stability of PIR Foam Insulation Board
In terms of mechanical strength, the compressive strength of PIR insulation board is usually 140-175 kPa (under 10% deformation conditions), and some products can reach above 150 kPa. This enables it to withstand roof construction loads, equipment installation pressures, and mechanical impacts during daily use.
In terms of dimensional stability, under the condition of 70℃ and 48 hours, the dimensional change rate of PIR board is usually controlled within 1.5%; at -30℃ low temperature conditions, it is even as low as 1.0%.
This excellent dimensional stability ensures that PIR board will not shrink, warp, or crack in extreme temperature differences (such as from summer high-temperature construction to winter low-temperature operation in cold storage buildings), guaranteeing the long-term integrity and airtightness of the insulation layer.
Environmental Friendliness and Sustainability of PIR Foam Insulation Board
The environmental performance of PIR insulation board is improving rapidly. Product life cycle assessment (LCA) data shows that the global warming potential (GWP, A1-A3 stages) of some PIR boards can be as low as 2.66 kg CO₂e/m². The industry is accelerating the transition to low-carbonization: BASF's Desmodur® CQ MS solution containing biomass raw materials can reduce the carbon footprint of PIR/PUR boards by 43%; Recticel Group has built an industrial recycling polyol plant, which can recycle up to 4,000 tons of PIR waste materials per year, with the carbon emissions of recycled polyol being approximately 40% lower than those of the original polyol.
In addition, Unilin's Utherm Next product has adopted 100% recycled polyol as the second-largest key component after MDI. In terms of the actual effect of building energy conservation, the simulation study shows that when the PIR insulation scheme is adopted in the renovation of existing educational buildings, the energy use intensity (EUI) can be reduced by 22.5% (based on 2024 climate data) to 29.9% (based on 2050 climate data).
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