Core Composition & Structural Design of PIR Wall Insulation Board
Layered Architecture
The panel features a three-layer structure:
Inner Rigid Core Foam Layer: Typically composed of polyurethane (PUR) or polyisocyanurate (PIR) foam, renowned for their exceptional thermal conductivity (λ-values as low as 0.020-0.022 W/m·K). The foam density ranges from 30-45 kg/m³, balancing insulation efficiency with structural rigidity.
Thickness Versatility
The available thicknesses (15-80mm) cater to varying thermal resistance requirements:
15-30mm: Suitable for internal partitions, light commercial buildings, or retrofitting projects where space is limited.
40-60mm: Ideal for exterior walls, roofs, and floors in residential homes, offering a balance of insulation and cost-effectiveness.
70-80mm: Used in industrial facilities, cold storage warehouses, or extreme climate zones requiring ultra-high thermal performance (R-values up to 7.0 m²·K/W for 80mm thickness).
Key Technical Features & Performance Metrics of PIR Wall Insulation Board
Thermal Insulation Efficiency
Thermal Resistance (R-value): Calculated as thickness (m) divided by λ-value. For example, a 50mm panel with λ=0.023 W/m·K has an R-value of ~2.17 m²·K/W, exceeding most building code requirements for energy-efficient structures.
Mechanical Properties
Compressive Strength: Ranges from 150-300 kPa, depending on thickness and density, making it suitable for load-bearing applications (e.g., floor insulation under concrete slabs).
Application of PIR Foam Board Insulation
Building Wall Insulation: Serves as the thermal core in external and internal wall assemblies, suitable for render, cladding, or mechanical fixing.
Building Roof Insulation: Ideal for flat or pitched roofs-can be applied above membranes or between rafters.
Floor Insulation Systems: Performs well in suspended and concrete floors, enhancing both thermal performance and indoor comfort.
Curtain Wall Systems & Cladding: Provides a non-combustible thermal barrier behind ventilated façades or glazed assemblies.
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